Question

What are four topics that can be categorized under packaging and enclosure design and analysis? (Select the four answers from the choices given below.)

a. electromagnetic issues (e.g., EMI)

b. electronic circuit design (e.g., using ICs verses discrete components)

c. maintenance and repair scheduling

d. mechanical issues (e.g., PCB racks, shock and vibration mounting)

e. thermal issues (e,g,, internal and external heat transfer)

f. thermomechanical management (e.g., thermal loads impact on the mechanical parts)

g. warranty repairs and merchandise returns due to product failures

Answer 1

Answer:

The correct options are:

a) electromagnetic issues (e.g., EMI)

b) electronic circuit design (e.g., using ICs versus discrete components)

d) mechanical issues (e.g., PCB racks, shock and vibration mounting)

e) thermal issues (e.g., internal and external heat transfer)

Explanation:

For packaging electronics and enclosure design analysis, an intrinsic part of it is to ensure the prevention of hazards such as electromechanical interference and damage owing to mechanical and thermal shock. As such, all the three options of a, d and e are already correct. Designing the electronic circuit is an intrinsic part of etching the circuit which comprises the 2nd level of electronic packaging. Packaged ICs also consume less material than discrete components. Thus option b is also correct. These are the four correct options as asked.

While ease of access at the time of repairing is a part of electronic packaging, the scheduling forms no part of it. The management of thermomechanical loads also plays no part in electronic packaging. Warranty repairs and merchandise repairs are relevant to product management and lifecycle, but not relevant to electronic packaging. Thus all these three options of c, f and g are incorrect and irrelevant.