Question

shirnking size of packaging

list them in order of the shrinking size of packaging from larger to smaller.

pin grid array(pga), quad flatpack(qfp), tape automated bonding(tab), ball grid array(bga), chip scale packaging(csp), flip chip

3. Let us consider the evolution of packaging shrinkage through the last three decades. Packaging size is being pressed by the shrinking feature size of CMOS integrated circuits. The followings are concerned on packaging technologies. List them in order of the shrinking size of packaging (from larger to smaller). (10) pin grid array, quad flatpack, tape-automated bonding, ball grid array, chip scale package, flip chip

Answer 1

Pin grid array,Quad flatpack, Ball grid array, , flip chip, chip scale package, tape automated bonding