Question

The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a function of factor A = adhesive type, factor B = cure time, and factor C= conductor material (copper and nickel). The data follows, along with an ANOVA table from Minitab.

		Cure Time
Copper		1	2	3
	1	72.7 80.0	74.6 77.5	80.0 82.7
Adhesive	2	77.8 75.3	78.5 81.1	84.6 78.3
	3	77.3 76.5	80.9 82.6	83.9 85.0
Nickel		1	2	3
	1	74.7 77.4	75.7 78.2	77.2 74.6
Adhesive	2	79.3 77.8	78.8 75.4	83.0 83.9
	3	77.2 78.4	84.5 77.5	89.4 81.2

Analysis of Variance for strength
Source	DF	SS	MS	F	P
Adhesive	2	101.317	50.659	6.54	0.007
CureTime	2	151.317	75.659	9.76	0.001
Conmater	1	0.722	0.722	0.09	0.764
Adhes*curet	4	30.526	7.632	0.98	0.441
Adhes*conm	2	8.015	4.008	0.52	0.605
Curet*conm	2	5.952	2.976	0.38	0.687
Adh*curet*conm	4	33.298	8.325	1.07	0.398
Error	18	139.515	7.751
Total	35	470.663

What conclusions can you draw from the data? Which factors are significant level 0.01? (Select all that apply.)

A) adhesive type

B) cure time

C) conductor material

D) There are no significant factors at level 0.01.

Which interactions are significant at level 0.01. (Select all that apply.)

A) adhesive type and cure time

B) adhesive type and conductor material

C) cure time and conductor material

D) adhesive type, cure time, and conductor material

E) There are no significant interactions at level 0.01.

Answer 1

Answer

(A) Using the given data output table for ANOVA, p values corresponding to variable Adhesive and Curetime are less than 0.01 level of significance.

So, only these two are significant

option A and B are correct

(B) Using the given data output table for ANOVA, p values corresponding to interactions are more than 0.01 level of significance.

So, none of them are significant

option E is correct.