Question

1. Select all true statements about lithography.

a. resolution is amount of radiant energy required to modify the solubility of the resist

b. immersion lithography yields higher resolution than normal photolithography

c. photoresist is placed between the oxide layer and the wafer

d. the resist mask is a temporary barrier that is locally removed for selective etching

e. projection printing is prone to mask damage

2. Select all true statements about micromachining.

a. ion machining is a lithographic machining process.

b. a typical etch rate is 10 Angstroms/min

c. plasma etching is a "dry" etching process

d. HF is an isotropic etch agent on SiO2

e. vsputter etching is like sand blasting at the micro level

f. REI uses ions with increased (more than plasma etching) energy

3. Select all true statements about nano and micro-machining background.

a. lab-on-a-chip devices are microfluidic devices

b. scaling laws explain why insects can fall from large heights without being damaged

c. size effects are unrelated to scaling laws

d. BOS units are orders of magnitude

e. an airplane and its parts have high tooling cost and low metrology cost

4. Select all true statements about vapor deposition.

a. LPCVD has lower deposition rates than APCVD

b. epitaxial growth is achieved through vapor deposition

c. PECVD generally has fewer impurities than LPCVD

d. evaporation is the main process used for deposition due to good step coverage

e. in PVD, ions are accelerated toward the wafer

5.Select all true statements about solution deposition.

a. R2R includes silk screening, CBD, and dip coating

b. solution deposition has lower capital cost and lower energy requirements than vapor deposition

c. spin coating is used to apply photoresist to wafers

d. gravure coating is also used in the printed media publishing industry

e. thermal ink-jets are able to print more wet chemistries than piezoelectric ink-jets

5. Select all true statements about semiconductors and wafers.

a. silicon is very conductive at room temperature

b. phosphorus doping makes silicon negatively charged

c. a boule ground with two opposite flats is p-type

d. the unit for sheet resistance is the ohm

e. dry oxidation is often used to grow thicker oxides

f. a diode is like a light switch

7.Select all true statements about IC's.

a. vias connect components

b. SSI class is used for multiplexers

c. as processing yield goes down, die yield goes up

d. as cleanroom class number goes up, the quantity of allowable particles goes down

e. rough topologies can be planarized

Answer 1

Solution :

As you have not specified any specific question so I am answering according to the HomeworkLib guidelines please cooperate.

Answer 1

Option b and option d are True statements.

immersion lithography yields higher resolution than normal photolithography as Immersion lithography scanners use a layer of Ultrapure water between the lens and the wafer to increase resolution.

Also

As depositing a photo-resist layer on said barrier layer photolithographically processing said photo-resist layer to selectively expose areas of said barrier layer for etching after etching is done the resist mask which is temporary barrier is locally removed.

So option b and d are correct.

Thank you

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