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If a homogeneous bodywith high diffusivity undergoes an exothermic reaction and Newtonian cooling...
Cooling fins are used to increase the area available for heat transfer between metal walls and...
Cooling fins are used to increase the area available for heat
transfer between metal walls and poorly conducting fluids such as
gases. A rectangular fin is shown in the following figure.
To design a cooling fin and calculate the fin efficiency one
must first calculate the temperature profile in the fin.
If L>>B, no heat is lost from the end or from the edges,
and the heat flux at the surface is given by:
in which the convective heat transfer...
2 of 6 04-Chem-A4/Dec 2012 1. A first-order, homogeneous, liquid-phase reaction (A - B) occurs in...
2 of 6 04-Chem-A4/Dec 2012 1. A first-order, homogeneous, liquid-phase reaction (A - B) occurs in a CSTR that operates adiabatically at steady state. The reaction is exothermic. Data are as follows and should be considered as exact quantities CA G, 1.75 molA/L (Inlet concentration of A) 2.5 J/g-K (The heat capacity of the reacting fluid; assumed constant at all conversions.) AH, -27 000 J/molA q-30 L/min (Flow into the CSTR.) (-rA) = 1.8( 1013)e(-84000 RDCA (The rate of reaction...
Two-Dimensional Steady and Transient Conduction - Cooling a very large scale microelectronic chip, A simplified representation...
Two-Dimensional Steady and Transient Conduction - Cooling a very
large scale microelectronic chip,
A simplified
representation for cooling in very large-scale integration (VLSI)
of microelectronics is shown in the sketch below. A silicon chip is
mounted in a dielectric substrate, and one surface of the system is
convectively cooled, while the reminding surfaces are well
insulated from the surrounding. The problem is rendered two
dimensional by assuming the system to be very large in the
direction perpendicular to the paper....
Problem: A reaction A+ R takes place in a constant-volume isothermal CSTR. The component mass balances...
Problem: A reaction A+ R takes place in a constant-volume isothermal CSTR. The component mass balances are: 1401 =CH-C, -kC,C, de=C-Cp+kC/CR dt where: Cai feed concentration of A (input); CRI: feed concentration of R (assumed constant); CA, CR: concentrations of A,R, respectively, in the reactor and outlet; t, k:, positive constants. a) Linearize the equations around the design steady-state (0.0...) (and put them in deviation variable form. b) Calculate the transfer function between CR and CA c) Under what conditions...
A simplified representation for cooling in very large- scale integration (VLSI) of microelectronics is shown in...
A simplified representation for cooling in very large- scale integration (VLSI) of microelectronics is shown in the sketch below. A silicon chip is mounted in a dielectric substrate, and one surface of the system is convectively cooled, while the reminding surfaces are well insulated from the surrounding. The problem is rendered two dimensional by assuming the system to be very large in the direction perpendicular to the paper. Under steady state (1) and transient (2) operation electronic power dissipation in...
Heat transfer Upon making an energy balance on the control mass of a problem, a governing...
Heat transfer
Upon making an energy balance on the control mass of a problem, a governing equation has been derived for determination of the temperature T(0) within the control mass as 1. dT with the initial condition where T, is the surrounding ambient temperature, V'is the volume of the control mass, A, İs the surface area and èpm > 0 . The usual meanings of the other symbols apply. Obtain the steady-state temperature Tss, ie., TSS-T(1 → the parameters appearing...
Chenical reaction, Figure 1: Two end of the rods are maintained at different temperatures A chemically...
Chenical reaction, Figure 1: Two end of the rods are maintained at different temperatures A chemically reacting mixture is stored in a thin-walled spherical container of radius 1 200 mm, and the exothermic reaction generates heat at a uniform, but temperature-dependent volumetric rate of q exp( A/T ), where如= 500 W/m3. A = 75 K. and To IS the mixture teinperature in kelvins. The vessel is enclosed by an insulating material of outer radius r2, thermal conductivity k, and emissivity...
(35pt) A new process for treatment of a special material is to be evaluated. A sphere...
(35pt) A new process for treatment of a special material is to be evaluated. A sphere of radius R (-5mm) is made of this special material. The physical properties of the materials are p 3000 kg/m k20Wm K), C, 1000 J(kgx K). 3. First step: An electric current is applied to the sphere to produce a total constant heat generation rate, S, (Unit: W), which can be considered spatially uniformly distributed through the sphere. And the surface of the spherical...
Newton’s Law of Cooling states that the temperature of an object changes in time according to...
Newton’s Law of Cooling states that the temperature of an object changes in time according to the equation dT =k(E−T)dt where T(t) is the temperature of the object, E is the temperature of the environment surrounding the object and k is a constant that is determined by the physical properties of the object. The value k can be expressed as k = hA , ρV cp where h is the heat-transfer coefficient (a measure of how quickly heat escapes the...
The upper and lower sides of the rectangular aluminum block L-10mm, D 3mm) are insulated as shown below. The left and r...
The upper and lower sides of the rectangular aluminum block L-10mm, D 3mm) are insulated as shown below. The left and right sides have temperature boundary conditions and convective boundary conditions, respectively Surface temperature T 100 C, Outside temperature T-20 C Heat transfer coefficent h 120W/(m2 k) Alumium thermal conductivity K-220 W/(m k), density p-2707kg/m Specific heat C896J/(kg K) Assuming the aluminum block is a two-dimensional shape, calculate the temperature on the plane(x-y) as follows. 1) Calculate the temperature of...
Cooling fins are used to increase the area available for heat
transfer between metal walls and poorly conducting fluids such as
gases. A rectangular fin is shown in the following figure.
To design a cooling fin and calculate the fin efficiency one
must first calculate the temperature profile in the fin.
If L>>B, no heat is lost from the end or from the edges,
and the heat flux at the surface is given by:
in which the convective heat transfer...
2 of 6 04-Chem-A4/Dec 2012 1. A first-order, homogeneous, liquid-phase reaction (A - B) occurs in a CSTR that operates adiabatically at steady state. The reaction is exothermic. Data are as follows and should be considered as exact quantities CA G, 1.75 molA/L (Inlet concentration of A) 2.5 J/g-K (The heat capacity of the reacting fluid; assumed constant at all conversions.) AH, -27 000 J/molA q-30 L/min (Flow into the CSTR.) (-rA) = 1.8( 1013)e(-84000 RDCA (The rate of reaction...
Two-Dimensional Steady and Transient Conduction - Cooling a very
large scale microelectronic chip,
A simplified
representation for cooling in very large-scale integration (VLSI)
of microelectronics is shown in the sketch below. A silicon chip is
mounted in a dielectric substrate, and one surface of the system is
convectively cooled, while the reminding surfaces are well
insulated from the surrounding. The problem is rendered two
dimensional by assuming the system to be very large in the
direction perpendicular to the paper....
Problem: A reaction A+ R takes place in a constant-volume isothermal CSTR. The component mass balances are: 1401 =CH-C, -kC,C, de=C-Cp+kC/CR dt where: Cai feed concentration of A (input); CRI: feed concentration of R (assumed constant); CA, CR: concentrations of A,R, respectively, in the reactor and outlet; t, k:, positive constants. a) Linearize the equations around the design steady-state (0.0...) (and put them in deviation variable form. b) Calculate the transfer function between CR and CA c) Under what conditions...
A simplified representation for cooling in very large- scale integration (VLSI) of microelectronics is shown in the sketch below. A silicon chip is mounted in a dielectric substrate, and one surface of the system is convectively cooled, while the reminding surfaces are well insulated from the surrounding. The problem is rendered two dimensional by assuming the system to be very large in the direction perpendicular to the paper. Under steady state (1) and transient (2) operation electronic power dissipation in...
Heat transfer
Upon making an energy balance on the control mass of a problem, a governing equation has been derived for determination of the temperature T(0) within the control mass as 1. dT with the initial condition where T, is the surrounding ambient temperature, V'is the volume of the control mass, A, İs the surface area and èpm > 0 . The usual meanings of the other symbols apply. Obtain the steady-state temperature Tss, ie., TSS-T(1 → the parameters appearing...
Chenical reaction, Figure 1: Two end of the rods are maintained at different temperatures A chemically reacting mixture is stored in a thin-walled spherical container of radius 1 200 mm, and the exothermic reaction generates heat at a uniform, but temperature-dependent volumetric rate of q exp( A/T ), where如= 500 W/m3. A = 75 K. and To IS the mixture teinperature in kelvins. The vessel is enclosed by an insulating material of outer radius r2, thermal conductivity k, and emissivity...
(35pt) A new process for treatment of a special material is to be evaluated. A sphere of radius R (-5mm) is made of this special material. The physical properties of the materials are p 3000 kg/m k20Wm K), C, 1000 J(kgx K). 3. First step: An electric current is applied to the sphere to produce a total constant heat generation rate, S, (Unit: W), which can be considered spatially uniformly distributed through the sphere. And the surface of the spherical...
The upper and lower sides of the rectangular aluminum block L-10mm, D 3mm) are insulated as shown below. The left and right sides have temperature boundary conditions and convective boundary conditions, respectively Surface temperature T 100 C, Outside temperature T-20 C Heat transfer coefficent h 120W/(m2 k) Alumium thermal conductivity K-220 W/(m k), density p-2707kg/m Specific heat C896J/(kg K) Assuming the aluminum block is a two-dimensional shape, calculate the temperature on the plane(x-y) as follows. 1) Calculate the temperature of...
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