Question

Describe how SPC methods were used to improve quality and productivity in a copper plating operation at a printed circuit board fabrication facility. List the DMAIC process steps in this project and describe how SPC magnificent tools were used in each DMAIC step.

Answer 1

The Spc method is characterized by high level of defects such as brittle copper and copper voids and by long flow time.Improvement of product flow time had a significant impact on defect.

The improvement team was formed with tank operator, manufacturer engineer and quality engineer.

Define- The team concentrated on reducing flow time through process and team determine excessive downtime on controller that regulate copper concentration on plating tank

Measure- Team decided to isolate the cause of controller downtime.

Analyse- Team analysed 11 potential cause such as

• Reagent replenshing
• Parastotic pump failure
• Electrical failure
• Temperature control
• Tubing maintainance
• Alarm system failure
• Concentration variation
• Plate out recirculation system
• Oxygen control
• Electrode replacement
• Recirculating pump failure .

  Improve- To improve the flowtime the logbook is examined and team agreed that whenever the equipment is down one team will take responsibility for filling out the checksheet.

Control- To control data is collected and run statistical control charts on the process, copper concentration is measured three times per day and analysed then after several process variable and had a significant reduction in defect.